Radeon 8050S
39B
Memory TypeSystem Shared
Boost Clock2800 MHz
TGP55 W
ArchitectureRDNA 3.5
Benchmarks
Gaming28
Render31
Energy85
TFLOPS (FP32)11.5
Geekbench OpenCL81,081
3DMarkTime Spy9171
Steel Nomad Lite Score8517
GB6 Compute Score81,081
G3D Mark Score16,451
Blender GPU1188.98
GB6 ML Single Precision18,145
GB6 ML Half Precision22,099
GB6 ML Quantized14,884
FLOPS (FP32)11.5 TFLOPS
Full specifications
3D Mark
Time Spy
9171
Solar Bay
41110
Port Royal
5181
Fire Strike
24607
Wild Life Extreme
18225
Night Raid
98347
GeekBench 6 OpenCL
Background Blur
201.1 img/sec
Face Detection
104.8 img/sec
Horizon Detection
2.53 Gpixels/sec
Edge Detection
3.37 Gpixels/sec
Gaussian Blur
3.12 Gpixels/sec
Feature Matching
0.93 Gpixels/sec
Stereo Matching
327.5 Gpixels/sec
Particle Physics
12215.6 FPS
API
OpenCL
Passmark Graphics
G2D Mark
1125
DirectX 11
149 FPS
DirectX 12
70 FPS
GPU Compute
7622 Ops/s
GeekBench 6 ML
Image Classification (SP)
9259
Image Segmentation (HP)
11219
Image Super Resolution (Q)
19775
Face Detection (HP)
31987
Pose Estimation (Q)
62399
Text Classification (SP)
3757
Machine Translation (HP)
6121
Object Detection (SP)
6979
Depth Estimation (Q)
35735
Style Transfer (SP)
129996
Framework
ONNX
Backend
DirectML
General
Vendor
Amd
Build
Integrated
Released
January 7, 2025
Case
Laptop
Purpose
Generic
Segment
Mid-range
Architecture
RDNA 3.5
GPU Codename
Strix Halo
Nvidia Equivalent
- GeForce RTX 4050 Laptop
Recommended CPU
- AMD Ryzen AI Max 385 or above
Used in CPUs
- AMD Ryzen AI Max 485 / - AMD Ryzen AI Max 490 / - AMD Ryzen AI Max PRO 485 / - AMD Ryzen AI Max PRO 490 / - AMD Ryzen AI Max 385 / - AMD Ryzen AI Max 390
Graphics Processing Unit
Base Clock
1295 MHz
Boost Clock
2800 MHz
Shading Units
2048
Texture Mapping Units (TMUs)
128
Render Output Units (ROPs)
64
Compute Units (Pipelines)
32
Tensor Cores
No
Ray-tracing Cores
32
L2 Cache
2MB shared
Instructions Per Cycle
2 IPC
Raw Performance
Pixel Fill Rate
179 GPixel/s
Texture Fill Rate
358 GTexel/s
Physical
Interface
PCIe 5.0 x16
TGP
55 W
Manufacturing
TSMC
Fabrication Process
4 nm
Die Size
308 mm²
Max. Temperature
100°C
Memory
Memory Type
System Shared
ECC
No
API
DirectX
12.2
Vulkan
1.4
OpenGL
4.6
OpenCL
2.1
CUDA
No
Ray Tracing
Yes
DLSS
No
DisplayPort
2.1a
Specifications compiled from NanoReview. Last updated 2026-09-29.
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