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Key specs
Memory Type
System Shared
Boost Clock
2800 MHz
TGP
55 W
Architecture
RDNA 3.5
Benchmarks
Rating
39
Gaming
28
Render
31
Energy
85
TFLOPS (FP32)
11.5
Geekbench OpenCL
81,081
3DMarkTime Spy
9171
Steel Nomad Lite Score
8517
GB6 Compute Score
81,081
G3D Mark Score
16,451
Blender GPU
1188.98
GB6 ML Single Precision
18,145
GB6 ML Half Precision
22,099
GB6 ML Quantized
14,884
FLOPS (FP32)
11.5 TFLOPS
3D Mark
Time Spy
9171
Solar Bay
41,110
Port Royal
5181
Fire Strike
24,607
Wild Life Extreme
18,225
Night Raid
98,347
GeekBench 6 OpenCL
Background Blur
201.1 img/sec
Face Detection
104.8 img/sec
Horizon Detection
2.53 Gpixels/sec
Edge Detection
3.37 Gpixels/sec
Gaussian Blur
3.12 Gpixels/sec
Feature Matching
0.93 Gpixels/sec
Stereo Matching
327.5 Gpixels/sec
Particle Physics
12215.6 FPS
API
OpenCL
Passmark Graphics
G2D Mark
1125
DirectX 11
149 FPS
DirectX 12
70 FPS
GPU Compute
7622 Ops/s
GeekBench 6 ML
Image Classification (SP)
9259
Image Segmentation (HP)
11,219
Image Super Resolution (Q)
19,775
Face Detection (HP)
31,987
Pose Estimation (Q)
62,399
Text Classification (SP)
3757
Machine Translation (HP)
6121
Object Detection (SP)
6979
Depth Estimation (Q)
35,735
Style Transfer (SP)
129,996
Framework
ONNX
Backend
DirectML
General
Vendor
Amd
Build
Integrated
Released
January 7, 2025
Case
Laptop
Purpose
Generic
Segment
Mid-range
Architecture
RDNA 3.5
GPU Codename
Strix Halo
Nvidia Equivalent
- GeForce RTX 4050 Laptop
Recommended CPU
- AMD Ryzen AI Max 385 or above
Used in CPUs
- AMD Ryzen AI Max 485 / - AMD Ryzen AI Max 490 / - AMD Ryzen AI Max PRO 485 / - AMD Ryzen AI Max PRO 490 / - AMD Ryzen AI Max 385 / - AMD Ryzen AI Max 390
Graphics Processing Unit
Base Clock
1295 MHz
Boost Clock
2800 MHz
Shading Units
2048
Texture Mapping Units (TMUs)
128
Render Output Units (ROPs)
64
Compute Units (Pipelines)
32
Tensor Cores
No
Ray-tracing Cores
32
L2 Cache
2MB shared
Instructions Per Cycle
2 IPC
Raw Performance
Pixel Fill Rate
179 GPixel/s
Texture Fill Rate
358 GTexel/s
Physical
Interface
PCIe 5.0 x16
TGP
55 W
Manufacturing
TSMC
Fabrication Process
4 nm
Die Size
308 mm²
Max. Temperature
100°C
Memory
Memory Type
System Shared
ECC
No
API
DirectX
12.2
Vulkan
1.4
OpenGL
4.6
OpenCL
2.1
CUDA
No
Ray Tracing
Yes
DLSS
No
DisplayPort
2.1a