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Intel Core i7 10875H
Intel Laptop CPU

Intel Core i7 10875H

39C
Cores8
Threads16
Boost Clock5.1 GHz
TDP45 W
SocketBGA-1440
Process14 nm
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Benchmarks

Perf.37
iGPU23
Energy44
Cinebench 2024 Single-Core73
Cinebench 2024 Multi-Core487
TDP45 W
Cache L316MB
Cinebench 2024 (Single)73
Cinebench 2024 (Multi)487
Geekbench 6 (Single-Core)1799
Geekbench 6 (Multi-Core)8189
Passmark CPU (Single-Core)2685
Passmark CPU (Multi-Core)14,390
Blender CPU117.26
iGPU FLOPS0.5 TFLOPS

Full specifications

GeekBench v6

File compression
689.5 MB/sec
Clang compilation
62.7 Klines/sec
HTML 5 Browser
188.5 pages/sec
PDF Renderer
278.3 Mpixels/sec
Text processing
175.8 pages/sec
Background blur
34.7 images/sec
Photo processing
72.3 images/sec
Ray tracing
12.7 Mpixels/sec

PassMark

Integer math
51.5 GOps/sec
Floating point math
32.5 GOps/sec
Find prime numbers
48M Primes/sec
Random string sorting
27.2M Strings/sec
Data encryption
4.9 GBytes/sec
Data compression
212.1 MBytes/sec
Physics
826 Frames/sec
Extended instructions
13.1B Matrices/sec

Performance Per Watt

Cinebench 2024 / Watt
10.8 PPW
Geekbench 6 Multi / Watt
182 PPW
Passmark CPU Mark / Watt
319.8 PPW
Blender / Watt
2.61 PPW

General

Vendor
Intel
Released
April 2, 2020
Type
Laptop
Instruction Set
x86-64
Codename
Comet Lake
Model number
i7-10875H
Integrated GPU
UHD Graphics 630

CPU

P-Cores
8
P-Threads
16
Base Frequency (P)
2.3 GHz
Turbo Boost Frequency (P)
5.1 GHz
Total Cores
8
Total Threads
16
Bus Frequency
100 MHz
Multiplier
23x
Bus Bandwidth
8 GT/s
L1 Cache
64K (per core)
L2 Cache
256K (per core)
L3 Cache
16MB (shared)
Unlocked Multiplier
No

Package

Fabrication Process
14 nm
TDP (PL1)
45 W
Socket
BGA-1440
Peak Temperature
100°C

iGPU

Integrated Graphics
Intel UHD Graphics 630
GPU Base Clock
350 MHz
GPU Boost Clock
1200 MHz
Shading Units
192
TMUs
24
ROPs
3
Execution Units
24
TGP
15 W

Memory Support

Memory Types
- DDR4-2933
Max. Memory Size
128 GB
Memory Channels
2
Max. Memory Bandwidth
45.8 GB/s
ECC Support
No

Misc

Official Site
Intel Core i7 10875H official page
PCI Express Version
3.0
PCI Express Lanes
16
Technologies
- Compute: ADX, BMI1, BMI2, CLMUL, F16C - Performance: EIST, HTT, TBT 2.0, TBT 3.0, TM1, TM2, TVB - Virtualization: VMX, VT-d, VT-x - Security: RDRAND, SGX, SMAP, SMEP, SMX, TXT, XD bit, vPro

Specifications compiled from NanoReview. Last updated 2026-09-29.

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