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Radeon 840M
AMD Laptop GPU

Radeon 840M

24D
Memory TypeSystem Shared
Boost Clock2900 MHz
TGP15 W
ArchitectureRDNA 3.5
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Benchmarks

Gaming7
Render13
Energy96
TFLOPS (FP32)1.5
Geekbench OpenCL14,025
3DMarkTime Spy1699
Steel Nomad Lite Score1319
GB6 Compute Score14,025
G3D Mark Score3674
Blender GPU120.67
GB6 ML Single Precision4884
GB6 ML Half Precision6067
GB6 ML Quantized3946
FLOPS (FP32)1.5 TFLOPS

Full specifications

3D Mark

Time Spy
1699
Solar Bay
6960
Port Royal
553
Fire Strike
5303
Wild Life Extreme
2671
Night Raid
22563

GeekBench 6 OpenCL

Background Blur
31.8 img/sec
Face Detection
16.8 img/sec
Horizon Detection
0.46 Gpixels/sec
Edge Detection
0.58 Gpixels/sec
Gaussian Blur
0.42 Gpixels/sec
Feature Matching
0.18 Gpixels/sec
Stereo Matching
52.5 Gpixels/sec
Particle Physics
2048.6 FPS
API
OpenCL

Passmark Graphics

G2D Mark
870
DirectX 11
32 FPS
DirectX 12
17 FPS
GPU Compute
1697 Ops/s

GeekBench 6 ML

Image Classification (SP)
1988
Image Segmentation (HP)
2184
Image Super Resolution (Q)
4788
Face Detection (HP)
6857
Pose Estimation (Q)
17396
Text Classification (SP)
1628
Machine Translation (HP)
2053
Object Detection (SP)
1825
Depth Estimation (Q)
8471
Style Transfer (SP)
31032
Framework
ONNX
Backend
DirectML

General

Vendor
Amd
Build
Integrated
Released
January 7, 2025
Case
Laptop
Purpose
Generic
Segment
Entry-level
Architecture
RDNA 3.5
GPU Codename
Krackan Point
Intel Equivalent
- Intel Arc 130T
Recommended CPU
- AMD Ryzen AI 5 340 or above
Used in CPUs
- AMD Ryzen AI 7 345 / - AMD Ryzen AI 5 430 / - AMD Ryzen AI 7 445 / - AMD Ryzen AI 5 435 / - AMD Ryzen AI 5 440 / - AMD Ryzen AI 5 340

Graphics Processing Unit

Base Clock
400 MHz
Boost Clock
2900 MHz
Shading Units
256
Texture Mapping Units (TMUs)
16
Render Output Units (ROPs)
8
Compute Units (Pipelines)
4
Tensor Cores
No
Ray-tracing Cores
4
L1 Cache
128KB per cluster
L2 Cache
1MB shared
Instructions Per Cycle
2 IPC

Raw Performance

Pixel Fill Rate
23 GPixel/s
Texture Fill Rate
46 GTexel/s

Physical

Interface
PCIe 4.0 x8
TGP
15 W
Manufacturing
TSMC
Fabrication Process
4 nm
Die Size
195 mm²
Max. Temperature
100°C

Memory

Memory Type
System Shared
ECC
No

API

DirectX
12
Vulkan
1.4
OpenGL
4.6
OpenCL
2.1
CUDA
No
Ray Tracing
Yes
DLSS
No
DisplayPort
2.1

Specifications compiled from NanoReview. Last updated 2026-09-29.

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