Radeon 740M
23D
Memory TypeSystem Shared
Boost Clock2500-2800 MHz (configurable)
TGP15 W
ArchitectureRDNA 3.0
Benchmarks
Gaming7
Render13
Energy93
TFLOPS (FP32)1.3-1.4
Geekbench OpenCL12,774
3DMarkTime Spy1571
Steel Nomad Lite Score1388
GB6 Compute Score12,774
G3D Mark Score2941
Blender GPU102.53
GB6 ML Single Precision4462
GB6 ML Half Precision5298
GB6 ML Quantized3419
FLOPS (FP32)1.3-1.4 TFLOPS
Full specifications
3D Mark
Time Spy
1571
Solar Bay
5514
Port Royal
722
Fire Strike
4931
Wild Life Extreme
3115
Night Raid
16642
GeekBench 6 OpenCL
Background Blur
31.6 img/sec
Face Detection
15.3 img/sec
Horizon Detection
0.44 Gpixels/sec
Edge Detection
0.56 Gpixels/sec
Gaussian Blur
0.47 Gpixels/sec
Feature Matching
0.17 Gpixels/sec
Stereo Matching
47 Gpixels/sec
Particle Physics
1815.3 FPS
API
OpenCL
Passmark Graphics
G2D Mark
778
DirectX 11
24 FPS
DirectX 12
16 FPS
GPU Compute
1628 Ops/s
GeekBench 6 ML
Image Classification (SP)
1608
Image Segmentation (HP)
2046
Image Super Resolution (Q)
5074
Face Detection (HP)
5435
Pose Estimation (Q)
16992
Text Classification (SP)
1469
Machine Translation (HP)
1922
Object Detection (SP)
1516
Depth Estimation (Q)
7572
Style Transfer (SP)
30182
Framework
ONNX
Backend
DirectML
General
Vendor
Amd
Build
Integrated
Released
January 4, 2023
Case
Laptop
Purpose
Generic
Segment
Entry-level
Architecture
RDNA 3.0
GPU Codename
Phoenix
Intel Equivalent
- Intel Arc iGPU (4-Cores)
Successor
- Radeon 840M
Recommended CPU
- AMD Ryzen 5 8540U or above
Used in CPUs
- AMD Ryzen 7 7445HS / - AMD Ryzen 5 Pro 215 / - AMD Ryzen 3 210 / - AMD Ryzen 5 220 / - AMD Ryzen Z1 / - AMD Ryzen 3 8300G / - AMD Ryzen 5 8500G / - AMD Ryzen 5 8540U / - and 2 more
Graphics Processing Unit
Base Clock
800 MHz
Boost Clock
2500-2800 MHz (configurable)
Shading Units
256
Texture Mapping Units (TMUs)
16
Render Output Units (ROPs)
8
Compute Units (Pipelines)
4
Ray-tracing Cores
4
L1 Cache
128KB per cluster
L2 Cache
2MB shared
Instructions Per Cycle
2 IPC
Raw Performance
Pixel Fill Rate
20-22 GPixel/s
Texture Fill Rate
40-45 GTexel/s
Physical
Interface
PCIe 4.0 x8
TGP
15 W
Manufacturing
TSMC
Fabrication Process
4 nm
Die Size
178 mm²
Transistor Count
25.4 billion
Transistor Density
142.7 MTr/mm²
Max. Temperature
95°C
Memory
Memory Type
System Shared
ECC
No
API
DirectX
12
Vulkan
1.3
OpenGL
4.6
OpenCL
2.1
Ray Tracing
Yes
DLSS
No
DisplayPort
2.1
Specifications compiled from NanoReview. Last updated 2026-09-29.
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