Home/Graphics Cards/GeForce RTX 2050 Mobile
GeForce RTX 2050 Mobile
Nvidia Laptop GPU

GeForce RTX 2050 Mobile

26C
Memory4 GB
Memory TypeGDDR6
Boost Clock1245-1477 MHz (configurable)
TGP30-45 W (configurable)
ArchitectureAmpere
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Benchmarks

Gaming14
Render20
Energy75
TFLOPS (FP32)5.1-6
Geekbench OpenCL42,967
3DMarkTime Spy3932
Steel Nomad Lite Score3967
GB6 Compute Score42,967
G3D Mark Score7720
Blender GPU752.18
GB6 ML Single Precision7807
GB6 ML Half Precision14,632
GB6 ML Quantized5491
FLOPS (FP32)5.1-6 TFLOPS
Memory Bandwidth112 GB/s

Full specifications

3D Mark

Time Spy
3932
Solar Bay
19073
Port Royal
413
Fire Strike
10472
Wild Life Extreme
7222
Night Raid
45365

GeekBench 6 OpenCL

Background Blur
73.3 img/sec
Face Detection
39.7 img/sec
Horizon Detection
1.65 Gpixels/sec
Edge Detection
2.13 Gpixels/sec
Gaussian Blur
2.06 Gpixels/sec
Feature Matching
0.55 Gpixels/sec
Stereo Matching
191.1 Gpixels/sec
Particle Physics
5921.5 FPS
API
OpenCL

Passmark Graphics

G2D Mark
479
DirectX 11
47 FPS
DirectX 12
42 FPS
GPU Compute
3507 Ops/s

GeekBench 6 ML

Image Classification (SP)
3489
Image Segmentation (HP)
7528
Image Super Resolution (Q)
6509
Face Detection (HP)
13217
Pose Estimation (Q)
24531
Text Classification (SP)
2148
Machine Translation (HP)
2764
Object Detection (SP)
3948
Depth Estimation (Q)
13355
Style Transfer (SP)
60626
Framework
ONNX
Backend
DirectML

General

Vendor
Nvidia
Build
Discrete
Released
December 17, 2021
Case
Laptop
Purpose
Gaming
Segment
Mid-range
Architecture
Ampere
GPU Codename
GA107
Recommended CPU
- Intel Core i5 11500H or above

Graphics Processing Unit

Base Clock
735-1185 MHz (configurable)
Boost Clock
1245-1477 MHz (configurable)
Shading Units
2048
Texture Mapping Units (TMUs)
64
Render Output Units (ROPs)
32
Compute Units (Pipelines)
16
Tensor Cores
64
Ray-tracing Cores
16
L1 Cache
64KB per cluster
L2 Cache
2MB shared
Instructions Per Cycle
2 IPC

Raw Performance

Pixel Fill Rate
40-47 GPixel/s
Texture Fill Rate
80-95 GTexel/s

Physical

Interface
PCIe 3.0 x8
TGP
30-45 W (configurable)
Manufacturing
Samsung
Fabrication Process
8 nm
Die Size
200 mm²
Transistor Count
8 billion
Transistor Density
40 MTr/mm²

Memory

Memory Type
GDDR6
Memory Size
4 GB
Memory Clock
1750 MHz
Effective Memory Speed
14000 Mbps
Bus
64-bit
ECC
No

API

DirectX
12
Vulkan
1.3
OpenGL
4.6
OpenCL
3.0
CUDA
8.6
Ray Tracing
Yes
DLSS
No
DisplayPort
1.4a

Specifications compiled from NanoReview. Last updated 2026-09-29.

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