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Key specs
Cores
10
Threads
10
TDP
35 W
Socket
Custom
Process
3 nm
Benchmarks
Rating
70
Perf.
65
iGPU
62
Energy
94
Cinebench 2024 Single-Core
120
Cinebench 2024 Multi-Core
889
TDP
35 W
Cache L3
6MB
Cinebench 2024 (Single)
120
Cinebench 2024 (Multi)
889
Geekbench 6 (Single-Core)
3279
Geekbench 6 (Multi-Core)
14,381
Passmark CPU (Single-Core)
4013
Passmark CPU (Multi-Core)
25,845
iGPU FLOPS
3.9 TFLOPS
PassMark
Integer math
61.9 GOps/sec
Floating point math
76.6 GOps/sec
Find prime numbers
276M Primes/sec
Random string sorting
38.6M Strings/sec
Data encryption
16.6 GBytes/sec
Data compression
270.6 MBytes/sec
Physics
2033 Frames/sec
Extended instructions
15.2B Matrices/sec
Performance Per Watt
Cinebench 2024 / Watt
25.4 PPW
Geekbench 6 Multi / Watt
410.9 PPW
Passmark CPU Mark / Watt
738.4 PPW
General
Vendor
Qualcomm
Released
January 5, 2026
Type
Laptop
Instruction Set
ARMv9
Codename
Snapdragon X
Model number
X2P-64-100
Integrated GPU
Adreno X2-45
Apple Equivalent
- Apple M4 (10-Core)
CPU
P-Cores
10
P-Threads
10
Base Frequency (P)
4.04 GHz
Total Cores
10
Total Threads
10
Bus Frequency
100 MHz
Multiplier
34x
L1 Cache
288K (per core)
L2 Cache
12MB (shared)
L3 Cache
6MB (shared)
Unlocked Multiplier
No
Package
Fabrication Process
3 nm
TDP (PL1)
35 W
Socket
Custom
iGPU
Integrated Graphics
Adreno X2-45
GPU Base Clock
500 MHz
GPU Boost Clock
1700 MHz
Shading Units
1152
TMUs
72
ROPs
36
Memory Support
Memory Types
- LPDDR5X-9523
Max. Memory Size
64 GB
Max. Memory Bandwidth
152 GB/s
ECC Support
No
Misc
Official Site
Qualcomm Snapdragon X2 Plus (X2P-64-100) official page
PCI Express Version
4.0
PCI Express Lanes
12