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Key specs
Cores
6
Threads
6
TDP
10 W
Socket
Custom
Process
3 nm
Benchmarks
Rating
65
Perf.
59
iGPU
58
Energy
97
Cinebench 2024 Single-Core
119
Cinebench 2024 Multi-Core
752
TDP
10 W
Cache L3
6MB
Cinebench 2024 (Single)
119
Cinebench 2024 (Multi)
752
Geekbench 6 (Single-Core)
3238
Geekbench 6 (Multi-Core)
11,957
Passmark CPU (Single-Core)
4022
Passmark CPU (Multi-Core)
16,980
Blender CPU
172.02
iGPU FLOPS
2.1 TFLOPS
PassMark
Integer math
36.4 GOps/sec
Floating point math
56.9 GOps/sec
Find prime numbers
212M Primes/sec
Random string sorting
23.9M Strings/sec
Data encryption
9.9 GBytes/sec
Data compression
165.4 MBytes/sec
Physics
1445 Frames/sec
Extended instructions
10.7B Matrices/sec
Performance Per Watt
Cinebench 2024 / Watt
75.2 PPW
Geekbench 6 Multi / Watt
1195.7 PPW
Passmark CPU Mark / Watt
1698 PPW
Blender / Watt
17.2 PPW
General
Vendor
Qualcomm
Released
January 5, 2026
Type
Laptop
Instruction Set
ARMv9
Codename
Snapdragon X
Model number
X2P-42-100
Integrated GPU
Adreno X2-45
Apple Equivalent
- Apple M2
CPU
P-Cores
6
P-Threads
6
Base Frequency (P)
4,04 GHz
Total Cores
6
Total Threads
6
Bus Frequency
100 MHz
Multiplier
34x
L1 Cache
288K (per core)
L2 Cache
12MB (shared)
L3 Cache
6MB (shared)
Unlocked Multiplier
No
Package
Fabrication Process
3 nm
TDP (PL1)
10 W
Max. Boost TDP (PL2)
22 W
Socket
Custom
iGPU
Integrated Graphics
Adreno X2-45
GPU Base Clock
500 MHz
GPU Boost Clock
910 MHz
Shading Units
1152
TMUs
72
ROPs
36
Memory Support
Memory Types
- LPDDR5X-9523
Max. Memory Size
64 GB
Memory Channels
8
Max. Memory Bandwidth
152 GB/s
ECC Support
No
Misc
Official Site
Qualcomm Snapdragon X2 Plus (X2P-42-100) official page
PCI Express Version
4.0
PCI Express Lanes
12