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Key specs
Cores
18
Threads
18
Boost Clock
5 GHz
TDP
96 W
Socket
Custom
Process
3 nm
Benchmarks
Rating
93
Perf.
92
iGPU
99
Energy
90
Cinebench 2024 Single-Core
160
Cinebench 2024 Multi-Core
1967
TDP
96 W
Cache L3
9MB
Cinebench 2024 (Single)
160
Cinebench 2024 (Multi)
1967
Geekbench 6 (Single-Core)
4004
Geekbench 6 (Multi-Core)
23,097
iGPU FLOPS
7.6 TFLOPS
GeekBench v6
File compression
2070 MB/sec
Clang compilation
224.4 Klines/sec
HTML 5 Browser
599.6 pages/sec
PDF Renderer
668.6 Mpixels/sec
Text processing
328 pages/sec
Background blur
82.4 images/sec
Photo processing
210.7 images/sec
Ray tracing
38.9 Mpixels/sec
Performance Per Watt
Cinebench 2024 / Watt
20.5 PPW
Geekbench 6 Multi / Watt
240.6 PPW
General
Vendor
Qualcomm
Released
September 25, 2025
Type
Laptop
Instruction Set
ARMv9
Codename
Snapdragon X
Model number
X2E-96-100
Integrated GPU
Adreno X2-90
Apple Equivalent
- Apple M5 Pro (18-Core)
CPU
P-Cores
18
P-Threads
18
Base Frequency (P)
3.6 GHz
Turbo Boost Frequency (P)
5 GHz
Total Cores
18
Total Threads
18
Bus Frequency
100 MHz
Multiplier
36x
L1 Cache
288K (per core)
L2 Cache
16MB (shared)
L3 Cache
9MB (shared)
Unlocked Multiplier
No
Package
Fabrication Process
3 nm
TDP (PL1)
96 W
Socket
Custom
Peak Temperature
100°C
Die Size
220 mm²
iGPU
Integrated Graphics
Adreno X2-90
GPU Base Clock
500 MHz
GPU Boost Clock
1850 MHz
Shading Units
2048
TMUs
128
ROPs
64
Execution Units
12
Memory Support
Memory Types
- LPDDR5X-9523
Max. Memory Size
128 GB
Memory Channels
10
Max. Memory Bandwidth
228 GB/s
ECC Support
No
Misc
Official Site
Qualcomm Snapdragon X2 Elite Extreme (X2E-96-100) official page
PCI Express Version
5.0
PCI Express Lanes
12