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Key specs
Cores
18
Threads
18
Boost Clock
4.7 GHz
TDP
65 W
Socket
Custom
Process
3 nm
Benchmarks
Rating
83
Perf.
79
iGPU
99
Energy
91
Cinebench 2024 Single-Core
149
Cinebench 2024 Multi-Core
1467
TDP
65 W
Cache L3
9MB
Cinebench 2024 (Single)
149
Cinebench 2024 (Multi)
1467
Geekbench 6 (Single-Core)
3577
Geekbench 6 (Multi-Core)
19,213
Passmark CPU (Single-Core)
4428
Passmark CPU (Multi-Core)
37,085
Blender CPU
325.66
iGPU FLOPS
7 TFLOPS
GeekBench v6
File compression
1570 MB/sec
Clang compilation
206.1 Klines/sec
HTML 5 Browser
479.6 pages/sec
PDF Renderer
637.3 Mpixels/sec
Text processing
307.8 pages/sec
Background blur
72.9 images/sec
Photo processing
151.8 images/sec
Ray tracing
34.3 Mpixels/sec
Performance Per Watt
Cinebench 2024 / Watt
22.6 PPW
Geekbench 6 Multi / Watt
295.6 PPW
Passmark CPU Mark / Watt
570.5 PPW
Blender / Watt
5.01 PPW
General
Vendor
Qualcomm
Released
September 25, 2025
Type
Laptop
Instruction Set
ARMv9
Codename
Snapdragon X
Model number
X2E-88-100
Integrated GPU
Adreno X2-90
CPU
P-Cores
18
P-Threads
18
Base Frequency (P)
3.4 GHz
Turbo Boost Frequency (P)
4.7 GHz
Total Cores
18
Total Threads
18
Bus Frequency
100 MHz
Multiplier
34x
L1 Cache
288K (per core)
L2 Cache
16MB (shared)
L3 Cache
9MB (shared)
Unlocked Multiplier
No
Package
Fabrication Process
3 nm
TDP (PL1)
65 W
Socket
Custom
Peak Temperature
100°C
Die Size
220 mm²
iGPU
Integrated Graphics
Adreno X2-90
GPU Base Clock
500 MHz
GPU Boost Clock
1700 MHz
Shading Units
2048
TMUs
128
ROPs
64
Execution Units
12
Memory Support
Memory Types
- LPDDR5X-9523
Max. Memory Size
128 GB
Memory Channels
8
Max. Memory Bandwidth
152 GB/s
ECC Support
No
Misc
Official Site
Qualcomm Snapdragon X2 Elite (X2E-88-100) official page
PCI Express Version
5.0
PCI Express Lanes
12