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Key specs
Cores
10
Threads
10
Boost Clock
4 GHz
TDP
35 W
Socket
Custom
Process
4 nm
Benchmarks
Rating
60
Perf.
54
iGPU
77
Energy
88
Cinebench 2024 Single-Core
109
Cinebench 2024 Multi-Core
826
TDP
35 W
Cache L3
6MB
Cinebench 2024 (Single)
109
Cinebench 2024 (Multi)
826
Geekbench 6 (Single-Core)
2380
Geekbench 6 (Multi-Core)
13,499
Passmark CPU (Single-Core)
3121
Passmark CPU (Multi-Core)
21,398
iGPU FLOPS
3.7-4.6 TFLOPS
PassMark
Integer math
53.6 GOps/sec
Floating point math
81.3 GOps/sec
Find prime numbers
266M Primes/sec
Random string sorting
30.9M Strings/sec
Data encryption
13.1 GBytes/sec
Data compression
210.7 MBytes/sec
Physics
1789 Frames/sec
Extended instructions
14.5B Matrices/sec
Performance Per Watt
Cinebench 2024 / Watt
23.6 PPW
Geekbench 6 Multi / Watt
385.7 PPW
Passmark CPU Mark / Watt
611.4 PPW
General
Vendor
Qualcomm
Released
September 4, 2024
Type
Laptop
Instruction Set
ARMv9
Codename
Snapdragon X
Model number
X1P-66-100
Integrated GPU
Adreno X1-85
Apple Equivalent
- Apple M3
CPU
P-Cores
10
P-Threads
10
Base Frequency (P)
3.4 GHz
Turbo Boost Frequency (P)
4 GHz
Total Cores
10
Total Threads
10
Bus Frequency
100 MHz
Multiplier
34x
L1 Cache
288K (per core)
L2 Cache
12MB (shared)
L3 Cache
6MB (shared)
Unlocked Multiplier
No
Package
Fabrication Process
4 nm
TDP (PL1)
35 W
Socket
Custom
iGPU
Integrated Graphics
Adreno X1-85
GPU Base Clock
300 MHz
GPU Boost Clock
1250 MHz
Shading Units
1536
TMUs
96
ROPs
48
Execution Units
6
TGP
30 W
Memory Support
Memory Types
- LPDDR5X-8448
Max. Memory Size
64 GB
Memory Channels
2
Max. Memory Bandwidth
135.2 GB/s
ECC Support
No
Misc
Official Site
Qualcomm Snapdragon X Plus (X1P-66-100) official page
PCI Express Version
4.0
PCI Express Lanes
12