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Key specs
Memory Type
System Shared
Boost Clock
2900 MHz
TGP
15 W
Architecture
RDNA 3.5
Benchmarks
Rating
29
Gaming
12
Render
20
Energy
95
TFLOPS (FP32)
5.9
Geekbench OpenCL
42,932
3DMarkTime Spy
3305
Steel Nomad Lite Score
3186
GB6 Compute Score
42,932
G3D Mark Score
8083
Blender GPU
302.04
GB6 ML Single Precision
9613
GB6 ML Half Precision
15,157
GB6 ML Quantized
7082
FLOPS (FP32)
5.9 TFLOPS
3D Mark
Time Spy
3305
Solar Bay
15,412
Port Royal
1795
Fire Strike
8908
Wild Life Extreme
6884
Night Raid
37,640
GeekBench 6 OpenCL
Background Blur
98.6 img/sec
Face Detection
42 img/sec
Horizon Detection
1.25 Gpixels/sec
Edge Detection
1.6 Gpixels/sec
Gaussian Blur
1.69 Gpixels/sec
Feature Matching
0.55 Gpixels/sec
Stereo Matching
214.8 Gpixels/sec
Particle Physics
7757.7 FPS
API
OpenCL
Passmark Graphics
G2D Mark
979
DirectX 11
73 FPS
DirectX 12
37 FPS
GPU Compute
4162 Ops/s
GeekBench 6 ML
Image Classification (SP)
3563
Image Segmentation (HP)
6170
Image Super Resolution (Q)
10,762
Face Detection (HP)
13,773
Pose Estimation (Q)
37,861
Text Classification (SP)
2572
Machine Translation (HP)
4699
Object Detection (SP)
2845
Depth Estimation (Q)
17,260
Style Transfer (SP)
86,751
Framework
ONNX
Backend
DirectML
General
Vendor
Amd
Build
Integrated
Released
June 3, 2024
Case
Laptop
Purpose
Generic
Segment
Mid-range
Architecture
RDNA 3.5
GPU Codename
Strix Point
Intel Equivalent
- Intel Arc 140V
Successor
- Radeon 8060S
Recommended CPU
- AMD Ryzen AI 9 HX 370 or above
Used in CPUs
- AMD Ryzen AI 9 HX 470 / - AMD Ryzen AI 9 HX 475 / - AMD Ryzen Z2 Extreme / - AMD Ryzen AI 9 HX 375 / - AMD Ryzen AI 9 HX 370
Graphics Processing Unit
Base Clock
400 MHz
Boost Clock
2900 MHz
Shading Units
1024
Texture Mapping Units (TMUs)
64
Render Output Units (ROPs)
32
Compute Units (Pipelines)
16
Tensor Cores
No
Ray-tracing Cores
16
L1 Cache
128KB per cluster
L2 Cache
2MB shared
Instructions Per Cycle
2 IPC
Raw Performance
Pixel Fill Rate
93 GPixel/s
Texture Fill Rate
186 GTexel/s
Physical
Interface
PCIe 4.0 x8
TGP
15 W
Manufacturing
TSMC
Fabrication Process
4 nm
Die Size
233 mm²
Transistor Count
34 billion
Transistor Density
145.92 MTr/mm²
Max. Temperature
100°C
Memory
Memory Type
System Shared
ECC
No
API
DirectX
12
Vulkan
1.4
OpenGL
4.6
OpenCL
2.1
CUDA
None
Ray Tracing
Yes
DLSS
No
DisplayPort
2.1