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Key specs
Memory Type
System Shared
Boost Clock
3000 MHz
TGP
55 W
Architecture
RDNA 3.5
Benchmarks
Rating
46
Gaming
36
Render
40
Energy
87
TFLOPS (FP32)
15.4
FLOPS (FP32)
15.4 TFLOPS
General
Vendor
Amd
Build
Integrated
Released
September 5, 2026
Case
Laptop
Purpose
Generic
Segment
Mid-range
Architecture
RDNA 3.5
GPU Codename
Gorgon Halo
Recommended CPU
- AMD Ryzen AI Max+ 495 or above
Used in CPUs
- AMD Ryzen AI Max+ PRO 495 / - AMD Ryzen AI Max+ 495
Graphics Processing Unit
Base Clock
1295 MHz
Boost Clock
3000 MHz
Shading Units
2560
Texture Mapping Units (TMUs)
160
Render Output Units (ROPs)
64
Compute Units (Pipelines)
40
Tensor Cores
No
Ray-tracing Cores
40
L2 Cache
2MB shared
Instructions Per Cycle
2 IPC
Raw Performance
Pixel Fill Rate
192 GPixel/s
Texture Fill Rate
480 GTexel/s
Physical
Interface
PCIe 5.0 x16
TGP
55 W
Manufacturing
TSMC
Fabrication Process
4 nm
Die Size
308 mm²
Max. Temperature
100°C
Memory
Memory Type
System Shared
ECC
No
API
DirectX
12.2
Vulkan
1.4
OpenGL
4.6
OpenCL
2.1
CUDA
No
Ray Tracing
Yes
DLSS
No
DisplayPort
2.1a