Head to head
Compare Graphics Cards
Pick up to 4. Winners are highlighted in green ▲.
1 selected
Key specs
Memory Type
System Shared
Boost Clock
2900 MHz
TGP
55 W
Architecture
RDNA 3.5
Benchmarks
Rating
42
Gaming
32
Render
34
Energy
85
TFLOPS (FP32)
14.8
Geekbench OpenCL
93,515
3DMarkTime Spy
10,038
Steel Nomad Lite Score
9837
GB6 Compute Score
93,515
G3D Mark Score
18,059
Blender GPU
1363.24
GB6 ML Single Precision
22,565
GB6 ML Half Precision
30,098
GB6 ML Quantized
18,100
FLOPS (FP32)
14.8 TFLOPS
3D Mark
Time Spy
10,038
Solar Bay
47,180
Port Royal
5546
Fire Strike
26,807
Wild Life Extreme
19,262
Night Raid
101,008
GeekBench 6 OpenCL
Background Blur
232.1 img/sec
Face Detection
122.5 img/sec
Horizon Detection
2.92 Gpixels/sec
Edge Detection
4.07 Gpixels/sec
Gaussian Blur
3.49 Gpixels/sec
Feature Matching
1.08 Gpixels/sec
Stereo Matching
396.3 Gpixels/sec
Particle Physics
13016.5 FPS
API
OpenCL
Passmark Graphics
G2D Mark
1171
DirectX 11
156 FPS
DirectX 12
84 FPS
GPU Compute
9032 Ops/s
GeekBench 6 ML
Image Classification (SP)
11,176
Image Segmentation (HP)
14,027
Image Super Resolution (Q)
27,198
Face Detection (HP)
40,613
Pose Estimation (Q)
92,878
Text Classification (SP)
4158
Machine Translation (HP)
6473
Object Detection (SP)
7431
Depth Estimation (Q)
41,825
Style Transfer (SP)
190,221
Framework
ONNX
Backend
DirectML
General
Vendor
Amd
Build
Integrated
Released
January 7, 2025
Case
Laptop
Purpose
Generic
Segment
Mid-range
Architecture
RDNA 3.5
GPU Codename
Strix Halo
Nvidia Equivalent
- GeForce RTX 4060 Laptop
Recommended CPU
- AMD Ryzen AI Max+ 395 or above
Used in CPUs
- AMD Ryzen AI Max+ 392 / - AMD Ryzen AI Max+ 388 / - AMD Ryzen AI Max+ 395 / - AMD Ryzen AI Max+ Pro 395
Graphics Processing Unit
Base Clock
1295 MHz
Boost Clock
2900 MHz
Shading Units
2560
Texture Mapping Units (TMUs)
160
Render Output Units (ROPs)
64
Compute Units (Pipelines)
40
Tensor Cores
No
Ray-tracing Cores
40
L2 Cache
2MB shared
Instructions Per Cycle
2 IPC
Raw Performance
Pixel Fill Rate
186 GPixel/s
Texture Fill Rate
464 GTexel/s
Physical
Interface
PCIe 5.0 x16
TGP
55 W
Manufacturing
TSMC
Fabrication Process
4 nm
Die Size
308 mm²
Max. Temperature
100°C
Memory
Memory Type
System Shared
ECC
No
API
DirectX
12.2
Vulkan
1.4
OpenGL
4.6
OpenCL
2.1
CUDA
No
Ray Tracing
Yes
DLSS
No
DisplayPort
2.1a