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Key specs
Memory Type
System Shared
Boost Clock
1900-2200 MHz (configurable)
TGP
15 W
Architecture
RDNA 2.0
Benchmarks
Rating
20
Gaming
5
Render
11
Energy
89
TFLOPS (FP32)
0.5-0.6
Geekbench OpenCL
5099
3DMarkTime Spy
519
Steel Nomad Lite Score
446
GB6 Compute Score
5099
G3D Mark Score
1799
Blender GPU
47.48
GB6 ML Single Precision
1917
GB6 ML Half Precision
2053
GB6 ML Quantized
1571
FLOPS (FP32)
0.5-0.6 TFLOPS
3D Mark
Time Spy
519
Solar Bay
2068
Port Royal
291
Fire Strike
1745
Wild Life Extreme
998
Night Raid
7335
GeekBench 6 OpenCL
Background Blur
12 img/sec
Face Detection
6.42 img/sec
Horizon Detection
0.16 Gpixels/sec
Edge Detection
0.23 Gpixels/sec
Gaussian Blur
0.16 Gpixels/sec
Feature Matching
0.07 Gpixels/sec
Stereo Matching
18.2 Gpixels/sec
Particle Physics
828.6 FPS
API
OpenCL
Passmark Graphics
G2D Mark
535
DirectX 11
17 FPS
DirectX 12
7 FPS
GPU Compute
768 Ops/s
GeekBench 6 ML
Image Classification (SP)
660
Image Segmentation (HP)
627
Image Super Resolution (Q)
2053
Face Detection (HP)
2153
Pose Estimation (Q)
5787
Text Classification (SP)
713
Machine Translation (HP)
1114
Object Detection (SP)
709
Depth Estimation (Q)
3233
Style Transfer (SP)
11,091
Framework
ONNX
Backend
DirectML
General
Vendor
Amd
Build
Integrated
Released
October 1, 2022
Case
Laptop
Purpose
Generic
Segment
Entry-level
Architecture
RDNA 2.0
GPU Codename
Mendocino
Recommended CPU
- AMD Ryzen 5 7520U or above
Used in CPUs
- AMD Ryzen 9 8945HX / - AMD Ryzen 9 8940HX / - AMD Ryzen 9 9850HX / - AMD Ryzen 9 9955HX / - AMD Ryzen 9 9955HX3D / - AMD Ryzen 5 9600X / - AMD Ryzen 7 9700X / - AMD Ryzen 9 7945HX3D / - and 6 more
Graphics Processing Unit
Base Clock
400 MHz
Boost Clock
1900-2200 MHz (configurable)
Shading Units
128
Texture Mapping Units (TMUs)
8
Render Output Units (ROPs)
4
Compute Units (Pipelines)
2
Ray-tracing Cores
2
L1 Cache
128KB per cluster
L2 Cache
2MB shared
Instructions Per Cycle
2 IPC
Raw Performance
Pixel Fill Rate
8-9 GPixel/s
Texture Fill Rate
15-18 GTexel/s
Physical
Interface
PCIe 4.0 x8
TGP
15 W
Manufacturing
TSMC
Fabrication Process
6 nm
Die Size
122 mm²
Transistor Count
3.4 billion
Transistor Density
27.87 MTr/mm²
Memory
Memory Type
System Shared
ECC
No
API
DirectX
12
Vulkan
1.3
OpenGL
4.6
OpenCL
2.0
Ray Tracing
Yes
DLSS
No